Raheem Basha Shaik

Senior Technical Lead – PCB Design with 13+ years of experience in automotive, RF, power, and IoT product designs. Specialized in end-to-end PCB development, validation, and manufacturing support. Currently leading the Build-to-Print (B2P) segment under the R&D department at Aumovio (Continental), acting as the Single Point of Contact (SPOC) for all PCB-related topics across India, China, North America, Europe, and Korea.
• Leading PCB design and validation for global automotive projects, ensuring compliance with DFM, DFT, and quality standards.
• Driving B2P acquisition activities, providing design feasibility and supporting 50+ PCB quotation requests annually.
• Collaborating with OEMs and Tier-1 customers to resolve design issues, perform DFM reviews, and improve manufacturability.
• Managing cross-functional collaboration with EE, ME, Test, and System teams to deliver First-Time-Right designs.
• Expert in schematic design, footprint creation, placement, routing, and Gerber release for up to 16-layer PCBs.
• Skilled in EMI/EMC design techniques, power electronics layout, and signal integrity optimization.
• Experienced across complete product lifecycle — concept, schematic, prototyping, validation, and production.
• Certified in ISO 13485:2016 and proficient in IPC-based library creation for symbols and footprints.
• Strong knowledge of BOM management, component engineering, and cost optimization.
• Hands-on in PCB bring-up, functional testing, and embedded board validation.
• Proficient with Zuken CR-8000, Mentor Xpedition, Valor NPI, Valor PP, CAM350, Altium, Allegro 17.4, and PADS VX.
• Leading DFM reviews, deviation handling, and PCB specification standardization for global projects.
• Driving process improvements and capability development to enhance Aumovio–B2P’s global PCB design efficiency and quality.
• Proven success in mentoring engineers and supporting global customers like Google, Comcast, TI, Hitachi, Bosch, TE Connectivity, and Cisco.